Micro Data Center

STULZ Micro DC

The STULZ Micro DC provides a cost-effective solution for rapidly deploying IT capacity exactly where it is needed. This modular and highly efficient solution can easily scale to accommodate the needs of today and the rapid growth of tomorrow, even in space constrained environments.

 

Each micro data center can be configured for low/mid density IT loads, and scale up to higher density workloads with a combination of integrated precision air cooling and Direct Contact Liquid Cooling (DCLC). 

Features & Benefits

  • Quick configuration & delivery

  • Drop-in solution (ease of install and expansion)

  • Scalable from low to high density using precision air and liquid-to-chip cooling options

  • Modular design with removable Integrated Cooling Solution (ICS) to fit through standard doorway

  • Configured, tested, and shipped from Frederick, MD USA

  • Worldwide sales & service network

  • Suitable for non-data center environments

STULZ Micro DC features a standard 19" rack which can be easily outfitted with user driven accessories and features.

View Rack Accessories / Features

The STULZ Micro DC is available in three self-enclosed cabinet designs, each with 48U of standard rack space. Air and liquid cooling modules can be configured depending on the IT load and need for redundant operation.  Usable rack space will be dependent on the options selected. Additionally, businesses big or small can scale data center capacity up or down to meet fluctuating demands.

  • Additional Configurations and Multi-Rack Solutions Upon Request

Precision Air: Integrated Cooling Solutions (ICS)

Side Mounted

  • Provides up to 27 kW of cooling = 48U Available
  • Minimal energy consumption
  • Provides precise temperature control
  • Available in chilled water, air, water and glycol cooled systems
  • EC Fans can be controlled independently of each other for optimum adaptation to different return air and supply air temperatures (ICS Side Mount)
  • STULZ’ state-of-the-art E2 Microprocessor with a range of BMS interface options

Precision Air: Integrated Cooling Solutions (ICS)

Internally Mounted

  • 3 kW (6U) per unit for additional cooling = 42U Remaining
  • Minimal energy consumption
  • Provides precise temperature control
  • Available in chilled water, air, water, and glycol cooled systems
  • STULZ state-of-the-art E2 Microprocessor with a range of BMS interface options

Direct Contact Liquid Cooling (DCLC)

Internally Mount

  • 80kW of chip level cooling per rack (@ 30C facility water)
  • Internal mount utilizes 4U = 44U Remaining
  • Manages 120+ servers
  • Quick and easy service
  • Uses only 652W
  • Servers remain hot-swappable for service
  • High temperature return water can be used for heat re-use

What is Chip-to-Atmosphere Liquid-to-Chip Cooling?

STULZ and CoolIT have partnered to combine precision air cooling and Direct Contact Liquid Cooling (DCLC) technology.  This unique combination creates Chip-to-Atmosphere cooling.

CoolIT’s DCLC™ technology uses the exceptional thermal conductivity of liquid to provide concentrated cooling to the hottest components inside a server, enabling very high density configurations even with today’s top performing processors. CoolIT’s liquid cooling solutions can be tailored to any server layout and have already been adopted by many server manufacturers as a reliable technology and is covered under standard warranties.

Dive into the Benefits of Liquid-to-Chip Cooling here!

Modular Cooling Configuration Examples

View Configurations

 

Fill out the contact form to talk to a Micro Data Center expert about your needs.

Downloads

Downloads

  • STULZ Micro Data Center Brochure

    • File: STULZ_Micro_Data_Center_Brochure.pdf

    • Type: Adobe PDF

    • Size: 3,11 MB

    • Language: English (US)

    • Date: 2017-06-14

    download
To top