Direct Chip Level Cooling Webinar

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Webinar on Direct Chip Level Cooling

DCD>New York will be hosting 24 free-to-view webinars between March 31 - April 2 to enable you to access expert thought-leadership and build your industry knowledge wherever you are in the world. 

Register here for free


Webinar: Direct Chip Level Cooling: CAPEX & OPEX Evaluations for Legacy Data Centers, Repurposed for Edge Deployments

When: March 31, 2020 at 1:00 PM EDT

Where: Virtual Conference - Sign up with DCD today!

Presenters:

Joerg Desler, President

Joerg Desler is President of STULZ Air Technology Systems, Inc. based in Frederick, Maryland, the US arm of STULZ, the global manufacturer of precision air conditioning, humidification and dehumidification systems. Joerg started with STULZ GmbH in 1992 and relocated to the US in 2001 where he was responsible for manufacturing, engineering as well as R&D before moving into his current role.  Joerg holds an Electrical Engineering degree from the University of Applied Sciences in Hamburg, Germany and is a member of APICS and ASHRAE.

David C. Meadows II, Director of Technology

David C. Meadows II has worked in data center cooling since 1999.  He is currently the Director of Technology at STULZ USA, a manufacturer of precision air conditioning, humidification, and dehumidification products specifically designed for the data center.  Previously David has served as both the Design Engineering Manager and the Applications Engineering Manager at Stulz.  David holds a Bachelor of Science degree in Mechanical Engineering from the University of Maryland Baltimore County.  David is also a graduate of the United States Navy Nuclear Power School.

Press Contact

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  • Press Contact

    For press information please contact:

    STULZ USA

    Marketing Department

    1572 Tilco Drive

    Frederick MD 21704

    Tel: (301) 620-2033

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