
Micro DC
Micro Data Center: All-in-one solutions for IT capacities – from office to data center
To Contact FormThe modular solution for scalable IT workloads
Micro Data Centers are a cost-effective way of providing scalable and self-sufficient IT resources that precisely target your needs, upgrade existing critical infrastructure, or simply provide additional computing and storage capacity at the edge of your network (edge computing).
Product Overview
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Traditional data centers and server rooms often need to be planned years in advance. Costly restructuring is not uncommon. The STULZ Micro DC offers an incomparable level of scalability that makes it possible to grow with the requirements. Depending on the requirements, the Micro DC can grow from a 1-rack configuration (from 3 kW) to a 6-rack configuration with a heat load of up to 480 kW. The STULZ Micro DC can drastically reduce your investment costs in IT infrastructure.
Technical data
- Cooling capacity total (kW): 3 – 80
- Precision air and direct liquid-to-chip cooling for particularly high heat loads
- Fast configuration & delivery
- Each device is individually configured, tested and delivered
- Worldwide sales and service network
- Suitable for non-data center environments
- Incomparable level of scalability with modular cooling configurations
- "Drop-in" solution (quick to install and easy to expand)
- Industry leading direct liquid-to-chip cooling for highly dense IT workloads
- Drop-in solution (quick install and easy to expand)
- Modular configurations with traditional precision cooling and industry leading liquid chip level cooling technology
- Modular design with removable Integrated Cooling Solution (ICS), so that the system fits through conventional door dimensions
- Suitable for non-data center environment
- For high-density workloads up to 80 kW per rack
- Two versions and three rack sizes
- 19” standard rack available in three different heights and two different depths
- Worldwide sales and service network
- Cooling capacity: 3 kW – 80 kW
- Precision air and direct liquid-to-chip cooling for particularly high heat loads

Scalability – Grow with your requirements
Scalable. Modular. Efficient.
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